The BGA 2UUL DA22 tool is a multifunctional set for motherboard repair and refurbishment work, equipped
with 5 specialized blades, models Q, U, I, C, and K, each designed for specific operations such as adhesive removal,
CPU separation, underfill cutting, and NAND chip separation. The C blade is specially designed for precise
lateral adhesive removal, allowing controlled scraping without damaging sensitive components. The integrated handle offers a
secure grip and good control during manual finishing work, and the high-temperature resistant material
retains its shape even at temperatures up to 300 degrees C. Manual use reduces
the need for hot air guns to remove underfill, helping
protect the motherboard from thermal stress.
Features:
- Dimensions: 136 x 7 x 10 mm
- Net weight: 9 g
- Included blades: Q, U, I, C, K
- Material: High-temperature resistant handle, metal blades
- Temperature resistance: up to 300C
- C blade for lateral adhesive removal
- Suitable for adhesive and underfill removal
- Suitable for CPU and NAND chip separation
- Integrated handle for control and precision