Presentation
| Product range | RL-044 |
| Product type | BGA Screen |
Sale package
| Pack | Blister |
| Content | BGA Screen |
| Product status | New |
Relife RL-044 BGA Stencil
The Relife RL-044 BGA stencil is a universal template for reballing, designed to provide high precision and maximum efficiency in the process
of soldering integrated circuits. Thanks to its compact design and premium stainless steel material, this stencil is resistant to
high temperatures and wear, ensuring a long service life. The precise positioning system allows for quick and even
application of solder balls, making it ideal for GSM service centers and professional electronic repair workshops.
Features:
- Universal BGA reballing stencil
- Equipped with four hole sizes: 0.3 mm, 0.35 mm, 0.4 mm, and 0.5 mm pitch
- Four types of spacing and multiple sizes
- Precise positioning system for quick solder ball placement
- High temperature resistance without deformation
- Compact design, easy to carry and use
- Compatible with most integrated circuits used in mobile phones
- Made from premium stainless steel for enhanced durability